MANUFACTURE OF HYBRID PRINTED CIRCUITS WHOSE FILM THICKNESS IS 105-400 MICRON AND 17-105 MICRON

摘要

PROBLEM TO BE SOLVED: To form a printed circuit at a time, by combining the etching process of a 35 micron surface with that of 400 micron surface, performing the processes continuously, and protecting the 35 micron film surface with ink, while the 400 micron film wiring is etched in a tunnel type etching equipment. ;SOLUTION: Programmed work (19) for forming holes is performed to a printed circuit. Graphite is deposited in previously formed holes (21). The cathode of a circuit is printed with ink (22). Electroplating with copper is performed (23). A positive circuit is protected with Sn/Pb alloy (29). The ink is cleaned (25). The single surface of a circuit of a 35 micron film is etched (12). The circuit of the 35 micron film is protected with ink (30). The other surface of a 400 micron film is etched (12). The ink is cleaned (25). The Sn/Pb is pickled (29). Solder masking work (17) between wirings is started by using a photosensitive screen.;COPYRIGHT: (C)1998,JPO