METHOD FOR IMPROVING PATTERN DESIGN FOR INTEGRATED CIRCUIT STRUCTURE PROCESSING

摘要

PROBLEM TO BE SOLVED: To improve the pattern design used for processing an integrated circuit by a method wherein the additional lines and the working lines to be formed on a semiconductor wafer have the equal surface region of conductive material with each other. ;SOLUTION: The distance in horizontal direction between the operating lines 2 and 3 exceeds the threshold distance X, and the distance in horizontal direction between operating lines 5, 6 and 7 and operating lines 8, 9 and 10 exceeds the threshold distance Y. As a result, dummy lines 11 to 16 are printed in a region 17 in order to guarantee the uniform printing of all operation lines. In order to guarantee the desired uniformity in the load for the patterning conducted for formation of both operation lines and dummy lines, a patterning operation is conducted on the single layer, consisting of conductive material, where both operating lines and dummy lines are formed, and the operation lines and the dummy lines are formed with the same material.;COPYRIGHT: (C)1997,JPO