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PROCESSING METHOD OF OXIDE, DEPOSITION METHOD OF AMORPHOUS OXIDE FILM AND AMORPHOUS TANTALUN OXIDE FILM
PROCESSING METHOD OF OXIDE, DEPOSITION METHOD OF AMORPHOUS OXIDE FILM AND AMORPHOUS TANTALUN OXIDE FILM
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机译:氧化物的制备方法,非晶氧化物膜的沉积方法和非晶钽氧化物膜的沉积方法
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摘要
PROBLEM TO BE SOLVED: To obtain a processing method of oxide suitable for high volume production in which insulation of an oxide can be enhanced greatly without causing surface roughening or compositional shift due to cross contamination or sputtering effect during processing by performing heat treatment at a specified temperature in an atmosphere containing ozone. ;SOLUTION: A nitride layer 12 is formed on the surface of a low resistance n+ type Si substrate 11 and Ta2O6 film 13 is deposited thereon. The n+ type Si substrate 11 deposited with Ta2O6 film 13 is then placed on a heater in an ozone annealing chamber and subjected to quick heat treatment at anneal temperature thus performing ozone annealing in an atmosphere containing ozone gas under the atmospheric pressure. In this regard, the ozone concentration of ozone anneal atmosphere is 5-20vol.% in O3/O2 ratio, the anneal temperature is 300-500°C and the anneal time is 5-60min. Thereafter, an Al electrode 14 is formed.;COPYRIGHT: (C)1998,JPO
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机译:要解决的问题:获得一种适合大批量生产的氧化物的加工方法,其中通过在指定的温度下进行热处理,可以大大提高氧化物的绝缘性,而不会由于加工过程中的交叉污染或溅射效应而导致表面变粗糙或组成变化。含有臭氧的大气中的最高温度。 ;解决方案:在低电阻n + Sup>型Si衬底11和Ta 2 Sub> O 6 Sub>膜13的表面上形成氮化层12沉积在其上。然后将沉积有Ta 2 Sub> O 6 Sub>膜13的n + Sup>型Si衬底11放置在臭氧退火室中的加热器上,并进行处理。在退火温度下进行快速热处理,从而在大气压下在包含臭氧气体的气氛中进行臭氧退火。在这方面,以O 3 Sub> / O 2 Sub>的比例,臭氧退火气氛中的臭氧浓度为5-20vol。%,退火温度为300-500°C,退火时间为5-60min。此后,形成铝电极14 。;版权所有:(C)1998,日本特许厅
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