INORGANIC MATTER SEAL FOR CAPSULING ORGANIC MATTER LAYER AND ITS FORMATION

摘要

PROBLEM TO BE SOLVED: To reduce a time and a cost when compared with a conventional method and make possible edge seal of high density since additional masks and employment of wet type etching are not required by providing an inorganic insulator seal for capsule sealing of a layer of an organic insulator between a first layer of an inorganic insulator and a second layer of an inorganic insulator. SOLUTION: In a constitution in which an inorganic insulator layer 12 and an organic polymide layer 13 are attached on a passivation layer (organic polyimide layer) 10 including metallic coating rings M3, S2, M2, S1, M1, after an opening attaining the metallic coating ring M3 and an edge seal channel region 15 are opened, an inorganic matter layer 16 is attached by CVD conformal deposition. Then, the inorganic matter layer 16 is etched by RIE, a seal is formed and the organic matter layer 10 is subjected to capsule sealing by inorganic matter such as SiO2 12, 16, 20. Thereby, even if a wafer is cut during a following treatment, transportation and stacking, the passivation layer 10 does not peel from the inorganic matter layer 20 and a metallic pat region.