首页> 外国专利> SUPPORTING DEVICE FOR SEMICONDUCTOR DEVICE, CARRIER FOR TESTING SEMICONDUCTOR DEVICE, FIXING METHOD FOR SEMICONDUCTOR DEVICE, METHOD FOR SEPARATING SEMICONDUCTOR DEVICE FROM SUPPORTING DEVICE, AND METHOD FOR MOUNTING SEMICONDUCTOR DEVICE ON CARRIER FOR TESTING

SUPPORTING DEVICE FOR SEMICONDUCTOR DEVICE, CARRIER FOR TESTING SEMICONDUCTOR DEVICE, FIXING METHOD FOR SEMICONDUCTOR DEVICE, METHOD FOR SEPARATING SEMICONDUCTOR DEVICE FROM SUPPORTING DEVICE, AND METHOD FOR MOUNTING SEMICONDUCTOR DEVICE ON CARRIER FOR TESTING

机译:用于半导体设备的支持设备,用于测试半导体设备的载体,用于半导体设备的固定方法,用于将半导体设备与支持设备分离的方法以及用于将半导体设备安装在用于载体的设备上的方法

摘要

PROBLEM TO BE SOLVED: To prevent the coming-off of a semiconductor device by the vibration or the like during the conveying, by installing a wiring to be brought into contact with an electrode of a semiconductor device, on a base, and pressing and fixing a supporting plate of the semiconductor device to the base by the magnetic force of a magnet and a magnetic member. ;SOLUTION: A recessed part 42 in which a rubber elastic body 43 is buried, is installed on an upper face of a wiring board for testing 41, a contact terminal 45 is installed on the inner edge parts of plural patterns for testing 44, and plural magnetic members 47 are buried around the elastic body 43. A recessed part 52 for supporting a bare chip 40 is formed in opposition to the elastic body 43 on a supporting base 51, and a permanent magnet 54 is installed in opposition to the magnetic member 47. A handling head 50 is moved for positioning the supporting base 51 in opposition to an upper part of the wiring board 41, the position is adjusted by a position recognizing camera 55, an image processing unit 56 and a driving mechanism 37, and the electrode 40a of the bare chip 40 and the contact terminal 45 are corresponded to each other by 1:1. The handling head 50 is lowered, so that the magnet and the magnetic member 47 are attracted, and strongly fixed, thereby, preventing the dislocation caused by the vibration or the like.;COPYRIGHT: (C)1998,JPO
机译:解决的问题:为了防止在输送过程中的振动等引起的半导体器件的脱落,通过在基板上安装与半导体器件的电极相接触的布线并压紧并固定,以防止半导体器件脱落。通过磁体和磁性构件的磁力将半导体器件的支撑板支撑到基座。 ;解决方案:将埋置有橡胶弹性体43的凹入部分42安装在测试用接线板41的上表面上,将接触端子45安装在多个测试用图案的内边缘部分44上,以及在弹性体43的周围埋入有多个磁性部件47。在支撑台51上,与弹性体43相对地形成有用于支撑裸芯片40的凹部52,在与该磁性部件相对的位置设置有永久磁铁54。 47.移动操作头50以使支撑基座51相对于布线板41的上部定位,该位置通过位置识别照相机55,图像处理单元56和驱动机构37以及位置传感器来调节。裸芯片40的电极40a和接触端子45彼此以1∶1对应。降低操作头50,以吸引并牢固地固定磁体和磁性部件47,从而防止由于振动等引起的错位。版权所有:(C)1998,JPO

著录项

  • 公开/公告号JPH1068758A

    专利类型

  • 公开/公告日1998-03-10

    原文格式PDF

  • 申请/专利权人 FUJITSU LTD;

    申请/专利号JP19970066990

  • 发明设计人 MARUYAMA SHIGEYUKI;FUKAYA FUTOSHI;

    申请日1997-03-19

  • 分类号G01R31/26;H01L21/66;

  • 国家 JP

  • 入库时间 2022-08-22 03:01:46

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