Plated surface smoothing method of solder or tin-plated molten material

摘要

PURPOSE: To provide a solder or tin plated metallic material capable of facilitating the application to the metallic wires and hoops of various materials by the mass production on an industrial scale, having uniform thickness of solder or tin plating, reduced in the inclusion of sludge, extremely reduced in ruggedness in a plated surface, and excellent in wettability. ;CONSTITUTION: A metallic material 1 after the completion of solder plating is passed, prior to immersion into a hot-dip solder plating bath 13, through a felt 10 wetted by kerosene to undergo the application of the kerosene to the whole surface and is then immersed into the plating bath 13. At the time of pulling up the plated metallic material in the direction perpendicular to the plating bath, a heated inert gas is sprayed in the direction parallel to the metallic material and also in the direction of the plating bath via gas nozzles 19 disposed in the vicinity of the surface of the plated bath and also vibrations are applied by means of a vibrator 15, by which the metallic material extremely reduced in the ruggedness in the plated surface and having uniform plating thickness can be obtained.;COPYRIGHT: (C)1993,JPO&Japio