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SYSTEM FOR TESTING WAFER AND ITS AUTOMATIC CALIBRATION SYSTEM

机译:晶圆测试系统及其自动校准系统

摘要

PROBLEM TO BE SOLVED: To provide a high-speed and low-cost system for testing wafers and its automatic calibration system. ;SOLUTION: In an instrumentation station 118, a wafer 124 is rotated in its vertical plane and a scanning sensor is moved linearly along a parallel axis with the rotational plane of the wafer 124 to obtain thereby spiral and other scanning paths of the wafer 124 over its whole surface. By holding the wafer 124 vertically in this way, the errors caused by the originating deflection from the weight of the wafer itself, especially the large wafer (e.g. 300mm in diameter), are reduced. Further, in the instrumentation station 118, providing a plurality of wafer grippers, they are moved in the plane of the wafer 124 to fasten it to the grippers in predetermined places for its rotation. Also, in the instrumentation station 118, a plurality of master calibration gauges 212 are provided to simplify thereby the calibration of the testing system for wafers, making any wafer for calibration tests unnecessary. Digitizing early the obtained probe instrumentation data of the wafer 124, they are calibrated thereafter in a digital way to decode them again and perform their filterings and other processings.;COPYRIGHT: (C)1998,JPO
机译:要解决的问题:提供一种用于测试晶圆的高速,低成本系统及其自动校准系统。解决方案:在仪器站118中,晶片124在其垂直平面中旋转,并且扫描传感器沿着与晶片124的旋转平面平行的轴线性移动,从而获得晶片124上的螺旋形和其他扫描路径它的整个表面。通过以这种方式垂直地保持晶片124,减少了由于晶片本身,特别是大晶片(例如直径为300mm)的重量而引起的初始偏转所引起的误差。此外,在提供多个晶片夹持器的仪器站118中,它们在晶片124的平面内移动,以将其固定在晶片旋转的预定位置的夹持器上。另外,在仪器站118中,提供了多个主校准仪212以简化用于晶片的测试系统的校准,从而不需要用于校准测试的任何晶片。较早地对获得的晶片124的探针仪器数据进行数字化,然后以数字方式对其进行校准,以再次对其进行解码并执行其过滤和其他处理。;版权所有:(C)1998,JPO

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