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METHOD FOR OF HIGH-GAIN MANUFACTURING HETEROJUNCTION BIPOLAR TRANSISTOR

机译:高增益制造异质结双极晶体管的方法

摘要

PROBLEM TO BE SOLVED: To provide a method for controlling an interval between an emitter mesa and a base ohmic metal of a heterojunction bipolar transistor, in order to obtain high gain and low parasitic base resistance. ;SOLUTION: An emitter, a base 24 and a collector layer 22 are epitaxial- grown on a base body 20, and a sacrificial layer of dielectric film is made to stick on the emitter layer. After an emitter mesa is patterned using a lithography technique, the sacrifice layer is etched to form an undercut. Then the emitter layer is etched, and the first photoresist layer, used for patterning the emitter mesa, and the entire device are coated with a lift-off resist 46, and it is lastly patterned, so as to form reentrant inclination on a base layer 24. An ohmic metal 48 for base is made to stick on the resist 46, and both the second resist layer and the resist on the emitter mesa are dissolved and lifted-off. The sacrificial layer is peeled off by isotropic etching, and base metal around the emitter mesa is left at an interval decided by undercut of the layer.;COPYRIGHT: (C)1998,JPO
机译:解决的问题:提供一种用于控制异质结双极晶体管的发射极台面和基极欧姆金属之间的间隔的方法,以获得高增益和低寄生基极电阻。解决方案:在基体20上外延生长发射极,基极24和集电极层22,并使介电膜的牺牲层粘附在发射极层上。在使用光刻技术使发射器台面图案化之后,蚀刻牺牲层以形成底切。然后,蚀刻发射极层,并在第一光刻胶层上对发射极台面进行构图,并在整个器件上涂覆剥离抗蚀剂46,最后对其进行构图,以便在基层上形成凹角。 24.使用于基底的欧姆金属48粘附在抗蚀剂46上,并且第二抗蚀剂层和发射极台面上的抗蚀剂均被溶解并剥离。通过各向同性蚀刻剥离牺牲层,并在发射极台面周围保留贱金属,其间隔取决于该层的底切。;版权:(C)1998,JPO

著录项

  • 公开/公告号JPH1098053A

    专利类型

  • 公开/公告日1998-04-14

    原文格式PDF

  • 申请/专利权人 TRW INC;

    申请/专利号JP19970182294

  • 发明设计人 LAMMERT MICHAEL;

    申请日1997-07-08

  • 分类号H01L21/331;H01L29/73;H01L29/205;

  • 国家 JP

  • 入库时间 2022-08-22 03:01:24

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