Registration manner and its device, inner lead bonding device and inner lead bonding manner null

摘要

PURPOSE:To enable a chip to be positioned easily and improve working efficiency in simple configuration by providing a positioning nib where reference surfaces in X and Y directions are formed near a chip stage by a cut-out part at right angle and by moving the chip stage in X and Y directions. CONSTITUTION:An XYtheta driving mechanism 15 is operated, a chip stage 11 moves toward the X, Y, and theta directions, thus pressing a chip 1 on the chip stage 11 to the cut-out part formed at a positioning nib 17. In this case, since the positioning nib 17 has an X-direction surface 18a and a Y-direction surface 18b, the chip 1 can be positioned by moving the chip stage 11 in the X, Y, and theta directions. Then, the chip stage 11 moves toward the direction of a tape 21. However, since the positioning nib 17 is a cut-out part at right angle, it is not necessary to lower the chip stage 11 once by moving the chip stage 11 toward the opening direction. By moving the chip stage 11, the chip 1 on the chip stage 11 can be positioned directly below the tape 21.