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DOUBLE GRID AND DOUBLE WELL SUBSTRATE PLATE TRENCH DRAM CELL ARRAY

机译:双栅格和双良好基板金属沟槽式DRAM单元阵列

摘要

A high density substrate plate trench DRAM cell memory device and processare described in which a buried region (32) is formed adjacent to deep trenchcapacitors such that the substrate region of DRAM transfer FETs can be electricallyisolated from other FETs on a semiconductor substrate (10). The buried region (32)is partially formed by ion implantation and diffusion to intersect the walls of thedeep trenches (22). The buried region (32) is contacted along its perimeter by areach through region to complete the isolation. The combined regions reducecharge loss due to better control of device parasitics.
机译:高密度衬底板沟槽DRAM单元存储器件和工艺描述了其中邻近深沟槽形成掩埋区(32)电容器,使得DRAM传输FET的衬底区域可以电与半导体衬底(10)上的其他FET隔离。掩埋区(32)通过离子注入和扩散来部分形成,以与管壁相交深沟(22)。掩埋区域(32)沿其周边接触到达区域以完成隔离。合并区域减少由于更好地控制了器件寄生效应,导致电荷损失。

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