Piping pressure sensor assemblies and leak prevention systems in semiconductor manufacturing equipment

摘要

To piping pressure sensor assemblies of semiconductor manufacturing equipment and to leak prevention systems of semiconductor manufacturing equipment.;The piping pressure sensor assembly of the semiconductor manufacturing equipment according to the present invention comprises a cylindrical non-conductive housing closed on one side by a blocking surface, a fixed plate hermetically fixed to the inner side wall of the housing, a moving plate comprising a metal plate opposed to the blocking surface, A non-conductive bellows in which both ends of the plate are fixed and close to each other, the inside of which is communicated with the pipe through the opening of the fixing plate, and a pair of metal-type capacitor-type sensors provided on the blocking surface. A piping leakage prevention system is a system that has an input valve and an output valve installed before and after a specific area on a piping of a semiconductor manufacturing equipment and a piping pressure sensor is installed between a specific part and an output valve. When the detected pressure is lower than a specified value, The input valve is locked, and the alarm It characterized by configured to be the same.;Therefore, it is possible to precisely detect pressure abnormality in a specific region of the piping of the semiconductor manufacturing equipment, and also to accurately detect the leakage and the position of the leak in the piping of the semiconductor manufacturing equipment.