Polishing method and polishing apparatus (POLISHING METHOD APPARATUS)

摘要

The present invention relates to a method for polishing a surface of a film formed on a substrate and a surface of the film using a polishing apparatus while relatively moving the polishing apparatus. The method includes: a position detecting step of detecting a predetermined position on a surface of a film; a first measuring step of measuring an absolute value of a film thickness at a predetermined position; A film thickness distribution measuring step of measuring a film thickness distribution of the film on the basis of the data obtained in the first measuring step and the second measuring step, And a control step of controlling the follow-up / stop of polishing based on the data obtained in the measuring step.