Method and apparatus for selectively attracting or repelling ionized material from a target surface during physical vapor deposition

摘要

The present invention provides an apparatus and method for reducing the likelihood that reverse sputtered material will be deposited on a target while enhancing target corrosion uniformity and efficiency. The target assembly provides sputtering of a unit of a target material and provides multiple, individually biased bias potentials at different bias potentials to prevent the reverse sputtered material from being deposited on a target unit that is minimally sputtered and preferably biased to a lower potential. Unit or section. The method is provided for individually biasing multiple units of a target structure to provide sputtering of the biased unit at higher potentials and to prevent deposition of reverse sputtered material on the lowered potential biased unit.