METHODS OF BONDING TWO ALUMINUM-COMPRISING MASSES TO ONE ANOTHER, METHODS OF BONDING A PHYSICAL VAPOR DEPOSITION TARGET MATERIAL TO BACKING PLATE MATERIAL, AND STRUCTURES COMPRISING ALUMINUM-COMPRISING PHYSICAL VAPOR DEPOSITION TARGETS AND BACKING PLATES

摘要

METHODS OF BONDING A TARGET TO A BACKING PLATEAbstract: The invention includes an aluminum-comprising physical vapor deposition target bonded to an aluminum-comprisingbacking plate to a bond stength of greater than 10,000 pounds/in[err]. The invention also includes a method of bonding a firstaluminum-comprising mass to a second aluminum-comprising mass. The first aluminum-comprising mass has a first surface,and the second aluminum-compri sing mass has a second surface. At least one of the first and second surfaces is exposed to a mixturecomprising HF and HNO[err], and the first surface is then contacted with the second surface. The first and second masses are pressed togetherto bond the first mass to the second mass. Additionally, the invention includes a method of bonding a physical vapor deposition targetmaterial to a backing plate material. The target material and backing plate material are joined in physical contact with one another. The target material and backing plate material are then compressed under a load that progresses sequentially as follows: (1) the load is maintained at a first pressure of at least about 4 ksi for a time of at least about 20 seconds; (2) the load is increased by at least about 0.5 ksi to a new pressure; and (3) the load is maintained at the new pressure for at least about 20 seconds.