Bump uniformizing apparatus for semiconductor chip and bump uniformizing method using the same

摘要

A bump uniformizing apparatus for a semiconductor chip is provided. The present invention relates to an apparatus for bump homogenization of a semiconductor chip constituted by a main section for making bumps of a semiconductor chip uniform and a system section connected to the main section for controlling the main section, A bump smoothing unit connected to the bump smoothing unit and connected to the bump smoothing unit and configured to apply a load to the bump smoothing unit, And a cylinder portion having a load sensor, wherein the system portion includes a temperature change display portion for displaying and controlling the operation of the temperature adjusting device of the bump fused portion, and a temperature change display portion for displaying and controlling the pressure applied to the bump smoothing portion by the load sensor A position change display section for displaying and controlling the distance that the bump uniformizing section is moved up and down, It includes. According to the present invention, the uniformity of the range formed on the semiconductor wafer and the intermetallic alloy layer of the bumps (alloying of bumps) can be achieved at the same time.