BUMP FLATTENING APPARATUS FOR OBTAINING Au BUMPS WITH UNIFORM HEIGHT, BUMP FLATTENING METHOD AND BUMP BONDING APPARATUS

摘要

PURPOSE: A bump flattening apparatus, a bump flattening method and a bump bonding apparatus are provided to obtain a plurality of Au bumps with a uniform height by using a roller. CONSTITUTION: A bump flattening apparatus(12) includes a loading part, a roller, a roller driving mechanism, and a horizontally moving mechanism. The loading part(16) is used for loading a substrate(40) with a plurality of bumps. The roller(18) is used for pressing heads of the bumps. The roller driving mechanism is used for rotating the roller. The horizontally moving mechanism is used for moving horizontally the loading part. The loading part seems almost still under a lower end of the roller.