Bijie semiconductor package and its manufacturing method

摘要

A semiconductor package and a method of manufacturing the same are disclosed. A BGA semiconductor package according to the present invention includes a substrate made of a metal material on which a semiconductor chip is mounted, and a lead connected by wire bonding to the chip. The lead has a plurality of conductive inks And the like. The present invention also relates to a method of manufacturing a BGA semiconductor package including a substrate on which a semiconductor chip is mounted and a lead connected to the chip by wire bonding, A step 3 of applying a plurality of conductive inks to the lower surface of the leads so as to be electrically conductive with the leads, And a step of cutting the lead and the dam bar protruding out of the molding layer. The method of manufacturing a semiconductor device according to the present invention includes the steps of: By employing the present invention, there are effects such as cost reduction, reduction in the number of manufacturing steps, effective heat release, and enhanced strength.