Bijie semiconductor package and its manufacturing method

摘要

(A) drawing a raw material of a solder ball formed on a lower surface of a lead portion, which is bonded by a semiconductor chip and wire bonding, into a solder ball forming fixture having a plurality of grooves and melting the lead material; (B) aligning the lead portion on the solder ball element; And (c) completing a solder ball by bringing the molten solder ball raw material into contact with a lower surface of the lead portion, and a solder ball forming jig itself forming the solder ball And the solder ball is heated and attached to the lead portion using the difference in thermal conductivity. Therefore, it is possible to prevent waste of excessive material, since there is no need for a material equivalent to the solder ball consumed when the solder ball is manufactured by etching the lead portion in half, and it is not difficult to control the thickness of the micro-etching of the lead portion due to the formation of the solder ball