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FABRICATION METHOD OF POLYSILICON THIN FILM BY METAL COATING

机译:金属涂层制备多晶硅薄膜的方法

摘要

The present invention relates to a method for producing a polycrystalline silicon thin film. More specifically, the present invention relates to a method for economically manufacturing a large-area polycrystalline silicon thin film at a low temperature by adsorbing a metal to an amorphous silicon thin film and heat treatment. The manufacturing method of the present invention comprises the steps of washing the substrate and depositing an amorphous silicon thin film by LPCVD or PECVD; Adsorbing a metal solution on the silicon thin film by spin coating to a substrate on which the amorphous silicon thin film obtained in the above step is deposited; And heat-treating the silicon thin film to which the metal solution obtained in the electrical process is adsorbed under an inert gas atmosphere at a temperature of 450 to 600 ° C., and the polycrystalline silicon thin film at a temperature lower than 100 ° C. than the conventional method by the present invention. Since it can be produced, it was confirmed that an inexpensive glass substrate can be used in place of an expensive substrate such as quartz, and at the same time, a large area polycrystalline silicon thin film can be economically produced.
机译:多晶硅薄膜的制造方法技术领域本发明涉及多晶硅薄膜的制造方法。更具体地,本发明涉及通过将金属吸附到非晶硅薄膜上并进行热处理而在低温下经济地制造大面积多晶硅薄膜的方法。本发明的制造方法包括以下步骤:洗涤基板并通过LPCVD或PECVD沉积非晶硅薄膜;通过旋涂将金属溶液吸附到硅薄膜上,以沉积在上面沉积了通过上述步骤获得的非晶硅薄膜的基板上;然后在惰性气体气氛下在450至600℃的温度下对吸附有通过电工艺获得的金属溶液的硅薄膜进行热处理,并在低于100℃的温度下对多晶硅薄膜进行热处理。与本发明的常规方法相比。由于可以制造,因此可以确认可以使用廉价的玻璃基板代替石英等昂贵的基板,并且可以经济地制造大面积的多晶硅薄膜。

著录项

  • 公开/公告号KR0144643B1

    专利类型

  • 公开/公告日1998-08-17

    原文格式PDF

  • 申请/专利权人 KAIST;

    申请/专利号KR19940038136

  • 发明设计人 안병태;손동균;

    申请日1994-12-28

  • 分类号H01L21/20;

  • 国家 KR

  • 入库时间 2022-08-22 02:47:18

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