A padless leadframe having a tie bar integrally formed with a chip bonding portion and a semiconductor chip package

摘要

The present invention relates to a padless leadframe having a tie bar integrally formed with a chip bonding portion and a semiconductor chip package using the padless leadframe, wherein a chip bonding portion separated from each tie bar of the padless leadframe is integrally formed, Since the leads are formed integrally with the tie bars, the reliability of the package due to the interface separation between the chip and the die pad is improved, flexibility is provided for designing the internal leads, and the length of the bonding wires electrically connecting the chip bonding portions and the bonding pads So that the stability of the wire bonding can be improved.