Method of cutting wafer

摘要

The present invention relates to a method for cutting a wafer, and more particularly to a method for forming a cover layer on an upper side of a wafer attracted to a vacuum chuck so that cutting particles generated during cutting are not dropped, and cutting the wafer with a cutting edge. Therefore, according to the present invention, when a wafer is cut, a cover layer is formed on the upper side of the wafer or cutting is performed while the wafer to be cut is turned upside down. Accordingly, it is possible to further improve the yield of the chips and to reduce defects.