COPPER-BASED ALLOY WITH HIGH ELECTRICAL CONDUCTIVITY AND SOFTENING TEMPERATURE FOR ELECTRONIC APPLICATIONS

摘要

P Copper-based alloy especially for applications in electronics, for the manufacture of component supports, characterized in that it contains between 0.1 to 1% by mass of nickel Ni and 0.005 to 0.1 % by mass of phosphorus P, the rest being copper. /P