The effects of annealing temperatre on the electrical conducitivity and mechanical property of Cu-Te alloys were studied via an AG-10TA electronic universal machine, an SB2230 digital electric bridge, SEM, EDS and XPS. The results show the electrical conductivity increases while the tensile strength fluctuates when the annealing temperature becomes higher because the recrystallization occurs during the annealing process, leading to the density of dislocation decreasing, grain size growing up, but the second phase precipitating sufficiently and simultaneously.
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机译:平成28年度论文赏受赏轮文:Effect of Si/Fe Composition, Substrate Temperature, and Substrate Orientation on the Structure and Magnetic Properties of Fe-Si Alloy Film
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