首页> 外国专利> Self-aligned N+/P+ doped polysilicon plugged contacts to N+/P+ doped polysilicon gates and to N+/P+ doped source/drain regions

Self-aligned N+/P+ doped polysilicon plugged contacts to N+/P+ doped polysilicon gates and to N+/P+ doped source/drain regions

机译:自对准N + / P +掺杂的多晶硅插入触点到N + / P +掺杂的多晶硅栅极和N + / P +掺杂的源极/漏极区域

摘要

A method for preparing an SRAM or DRAM structure on a substrate with an oppositely doped well therein, a field oxide region extending above and between the well and the substrate, first and second NMOS transistors on the silicon substrate, an NMOS word line transistor over the field oxide region, and a PMOS transistor on the silicon well. The source and drain regions of each of the PMOS transistor and the first and second NMOS transistors each have a doped polysilicon plug making contact therewith. The NMOS word line has a polysilicon plug contacting the gate electrode thereof. Each polysilicon plug is isolated one from another, has the same doping as the region with which it makes contact, and is self-aligned to surrounding structures due to etchant selectivities and photoresist masks. The SRAM or DRAM structure is formed in an inventive process having two masking steps, where each masking step opens areas for self-aligned plugs having a common doping and opens a region above the NMOS word line.
机译:一种用于在其中具有相反掺杂的阱的衬底上制备SRAM或DRAM结构的方法,在阱和衬底上方和之间延伸的场氧化区域,硅衬底上的第一和第二NMOS晶体管,在衬底上方的NMOS字线晶体管场氧化物区和硅阱上的PMOS晶体管。每个PMOS晶体管的源极和漏极区以及第一和第二NMOS晶体管的每个都具有与之接触的掺杂的多晶硅插塞。 NMOS字线具有与其栅极接触的多晶硅塞。每个多晶硅插塞彼此隔离,与它接触的区域具有相同的掺杂,并且由于蚀刻剂的选择性和光致抗蚀剂掩模而与周围结构自对准。 SRAM或DRAM结构是在具有两个掩模步骤的发明过程中形成的,其中每个掩模步骤为具有共同掺杂的自对准插塞打开区域,并在NMOS字线上方打开区域。

著录项

  • 公开/公告号US5718800A

    专利类型

  • 公开/公告日1998-02-17

    原文格式PDF

  • 申请/专利权人 MICRON TECHNOLOGY INC.;

    申请/专利号US19950555496

  • 发明设计人 WERNER JUENGLING;

    申请日1995-11-08

  • 分类号H01L21/00;

  • 国家 US

  • 入库时间 2022-08-22 02:40:11

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