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Ferroelectrics thin-film coated substrate and manufacture method thereof and nonvolatile memory comprising a ferroelectrics thinfilm coated substrate

机译:铁电薄膜涂覆基板,其制造方法以及包括铁电薄膜涂覆基板的非易失性存储器

摘要

A ferroelectrics thin-film coated substrate is manufactured in a low- temperature process by using a ferroelectrics having a dense and even surface and exhibiting a large residual spontaneous polarization. A ferroelectrics thin-film coated substrate has a structure with a buffer layer, a growth layer allowing a ferroelectrics thin-film to grow, and a ferroelectrics thin-film made of a ferroelectric material having a layered crystalline structure expressed in the chemical formula Bi.sub.2 A.sub.m-1 B.sub.m O.sub.3m+3 (A is selected from Na.sup.1+, K.sup.1+, Pb. sup.2+, Ca.sup.2+, Sr.sup.2+, Ba.sup.2+, Bi.sup.3+ and the like, B is selected from Fe.sup.3+, Ti.sup.4+, Nb.sup.5+, Ta.sup.5+, W.sup.6+ and Mo. sup.6+, and m is an integer not less than 1) formed in succession.
机译:通过使用具有致密且平坦的表面并表现出大的残留自发极化的铁电材料,在低温工艺中制造铁电薄膜涂覆的基板。铁电薄膜涂覆基板具有以下结构:缓冲层,允许铁电薄膜生长的生长层,以及由铁电材料制成的铁电薄膜,该铁电材料具有以化学式Bi表示的层状晶体结构。 sub.2 A.sub.m-1 B.sub.m.O.sub.m.3m + 3(A选自Nasup.1 +,Ksup.1 +,Pb.sup.2 +,Ca。 sup.2 +,Sr.sup.2 +,Ba.sup.2 +,Bi.sup.3 +等,B选自Fe.sup.3 +,Ti.sup.4 +,Nb.sup 0.5 +,Ta 5 +,W 6+和Mo 6+,并且m是连续形成的不小于1)的整数。

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