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PHENOLIC RESIN COMPOSITION, PHENOLIC RESIN LAMINATE, AND COPPER-CLAD PHENOLIC RESIN LAMINATE

机译:酚醛树脂组合物,酚醛树脂层压板和覆铜箔酚醛树脂层压板

摘要

PROBLEM TO BE SOLVED: To obtain a composition having a low dispersion of flame retardancy and used for the production of phenolic resin laminated or copper-clad phenolic resin laminates by using a resol phenolic resin, a phosphoric ester, and a melamine phosphate as the essential components. ;SOLUTION: The phosphoric ester used is exemplified by an ester of phosphoric acid with an alcohol or a phenol. The melamine phosphate is desirably one having a phosphorus content of 5-25 wt.% and a nitrogen content of 30-50 wt.%. It is desirable that the phosphoric ester and the melamine phosphate are used in amounts of 10-100 pts.wt. and 3-20 pts.wt. per 100 pts.wt. resol phenolic resin, respectively. This composition is dissolved in a solvent to form a varnish, and a fibrous base is impregnated with the varnish and dried to form a prepreg. A plurality of such prepregs are laminated, and the assemblage are heated under pressure to obtain a laminate. Alternatively, the desired number of prepregs and the desired number of copper foils are laminated, and the assemblage is heated under pressure to obtain a copper-clad laminate.;COPYRIGHT: (C)1999,JPO
机译:解决的问题:为了获得阻燃性低的分散体并以甲阶酚醛酚醛树脂,磷酸酯和三聚氰胺磷酸酯为主要成分而用于酚醛树脂层压板或覆铜酚醛树脂层压板的制造的组合物组件。 ;解决方案:所用的磷酸酯的例子是磷酸与醇或酚的酯。期望的三聚氰胺磷酸盐是磷含量为5-25wt。%和氮含量为30-50wt。%的一种。希望磷酸酯和三聚氰胺磷酸盐的用量为10-100pts.wt。和3-20 pts.wt.每100磅甲阶酚醛树脂。将该组合物溶解在溶剂中以形成清漆,并用清漆浸渍纤维基并干燥以形成预浸料。层叠多个这样的预浸料,并在压力下加热组件以获得层叠体。或者,将所需数量的预浸料和所需数量的铜箔进行层压,然后在压力下加热组件,以获得覆铜层压板。;版权所有:(C)1999,JPO

著录项

  • 公开/公告号JPH11279371A

    专利类型

  • 公开/公告日1999-10-12

    原文格式PDF

  • 申请/专利权人 HITACHI CHEM CO LTD;

    申请/专利号JP19980079980

  • 申请日1998-03-26

  • 分类号C08L61/06;B32B15/08;B32B27/42;C08K5/521;H05K1/03;

  • 国家 JP

  • 入库时间 2022-08-22 02:38:03

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