LEAD FRAME, MOLDING DIE FOR RESIN ENCAPSULATED SEMICONDUCTOR DEVICE USING THE LEAD FRAME, RESIN ENCAPSULATED SEMICONDUCTOR DEVICE USING THE LEAD FLAME AND MANUFACTURE OF THE RESIN ENCAPSULATED SEALED SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a lead frame which does not generate inspection defects due to connection failures between a lead and a contactor for electrical characteristics measurement. ;SOLUTION: This lead frame 101 is provided with a tab 1 for fixing a semiconductor element, a frame part 104 arranged around the tab 1 and plural leads 2 and the frame part 104 is provided with plural common connection parts 6 for connecting the plural leads 2 in common, at positions which face at least two sides 1a and 1b of the tab 1 and supporting parts 7 arranged at the positions facing at least sides 1c and 1d which are different from the two sides. The lead frame 101 is further provided with a suspension lead 3 connected to the common connection part 6 and the tab 1 for supporting the tab 1, and the supporting part 7 is provided with a projection part 8 projected from the supporting part 7 to be sealed inside a resin encapsulating body 51, at resin encapsulating and pulled out of the resin encapsulating body 51 after the resin encapsulation.;COPYRIGHT: (C)1999,JPO