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GALLIUM ARSENIC SINGLE CRYSTAL INGOT, ITS PRODUCTION, AND GALLIUM ARSENIC SINGLE CRYSTAL WAFER USING THE SAME

机译:砷化镓单晶硅锭,其生产方法以及使用相同方法的砷化镓单晶硅片

摘要

PROBLEM TO BE SOLVED: To make the production of wafers suitable for the ion injection producible in a high yield by obtaining GaAs single crystal that has a low EL2 concentration and high uniformity from the top to the tail. ;SOLUTION: Seed crystal 3 of GaAs single crystal 3 is arranged in the lower part of the crucible 5 in the rack 8 and GaAs polycrystal is charged in the remaining space of the crucible 5 and the polycrystal are covered with B2O3 as a sealant 4. Then, an inert gas is introduced into the air-tight vessel 10 and the pressure is adjusted to a prescribed value. The crucible is heated, with the heater 6 so that the temperature in the upper part may become more than 5°C higher than the bottom temperature to melt the GaAs polycrystal. Then, the rack 8 is allowed to move downward with the lower shaft 19 to solidify the polycrystal melt 2 thereby growing a single crystal of GaAs. The resultant GaAs single crystal ingot has the EL concentration ranging of from 0.8 to 1.4×1016 cm-3, the change rate of the EL2 concentration is ≤10% at the top and the tail and the single crystal is homogeneous.;COPYRIGHT: (C)1999,JPO
机译:要解决的问题:通过获得从顶部到尾部具有低EL2浓度和高均匀性的GaAs单晶,可以高产量地生产适用于离子注入的晶片。 ;解决方案:GaAs单晶3的籽晶3放在机架8中的坩埚5的下部,GaAs多晶填充在坩埚5的剩余空间中,并且多晶被B 2 < / Sub> O 3 作为密封剂4。然后,将惰性气体引入气密容器10中,并将压力调节至规定值。用加热器6加热坩埚,使得上部的温度可以比底部的温度高5℃以上,以熔化GaAs多晶。然后,使齿条8与下轴19一起向下移动以固化多晶熔体2,从而生长GaAs单晶。所得的GaAs单晶锭的EL浓度范围为0.8至1.4×10 16 cm -3 ,在此温度下EL2浓度的变化率≤10%。顶部,尾部和单晶是均质的。版权所有:(C)1999,日本特许厅

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