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Gallium vacancy production in carbon oxygen and arsenic irradiated n-type gallium arsenide

机译:碳氧和砷辐照n型砷化镓中镓的空位生成

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Abstract: Ion implantation of semiconductors results in the introduction of vacancies, interstitials, antisites and complexes involving these defects. The donor to gallium vacancy and the free electron to gallium vacancy transitions occurs at 1.4745 and 1.4785 eV respectively in the photoluminescence (PL) spectrum of irradiated n-type gallium arsenide (GaAs) slightly doped with silicon, when the samples temperature is 4K. We have implanted 4 $mu@m thick GaAs films grown on bulk GaAs with carbon, oxygen and arsenic ions in order to determine the V$-Ga$/ introduction rate using PL. The particle energy was chosen such that the stopping range covered 2 to 20 $mu@m. The production rate is in agreement with Rutherford scattering theory, in which only primary knock out processes are considered when the stopping range is much greater than the epilayer thickness, but less than the theory when the particles are implanted in the epilayer. Since vacancies are created by both primary and secondary ion collisions and removed by recombinations, the data suggests that secondary ion collisions and recombinations are unimportant at high energies when the particles go right through the samples, or that their effects cancel out. At low energies, when implantation occurs, the combined data suggests that vacancies are removed through recombinations at a faster rate than they are produced by secondary ions collisions. !20
机译:摘要:半导体的离子注入导致引入了涉及这些缺陷的空位,间隙,反位点和络合物。当样品温度为4K时,在轻掺杂硅的n型砷化镓(GaAs)的光致发光(PL)光谱中,镓空位的供体跃迁和自由电子至镓空位跃迁分别发生在1.4745和1.4785 eV处。我们已经用碳,氧和砷离子注入了在块状GaAs上生长的4微米厚度的GaAs膜,以便使用PL确定V $ -Ga $ /的引入速率。选择粒子能量使得停止范围覆盖2至20μm。生产率与卢瑟福散射理论是一致的,卢瑟福散射理论中,当停止范围远大于表层厚度时,仅考虑初次敲除过程,但小于将粒子植入表层时的理论。由于空位是由一次和二次离子碰撞产生并通过复合消除的,因此数据表明,当粒子正好穿过样品时,在高能下,二次离子碰撞和复合并不重要,或者它们的作用会抵消。在低能量下,当发生注入时,组合数据表明,空位通过重组被去除的速率比次级离子碰撞所产生的空位要快。 !20

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