首页> 外国专利> METHOD OF FORMING SEMICONDUCTOR LAYER EPITAXIALLY GROWN ON METAL LAYER AND LIGHT EMITTING SEMICONDUCTOR DEVICE MANUFACTURED USING THE METHOD

METHOD OF FORMING SEMICONDUCTOR LAYER EPITAXIALLY GROWN ON METAL LAYER AND LIGHT EMITTING SEMICONDUCTOR DEVICE MANUFACTURED USING THE METHOD

机译:在金属层上形成表观生长的半导体层的方法以及使用该方法制造的发光半导体装置

摘要

PROBLEM TO BE SOLVED: To form a single crystal semiconductor layer on a metal layer formed on an insulative substrate wherein this semiconductor can be directly formed on the metal layer. SOLUTION: In the method of forming a single crystal semiconductor layer on a metal layer, on the occasion of the metal layer being formed on an insulative substrate having a surface to form layers and the single crystal structure semiconductor layer on the metal layer 11, the epitaxially grown metal layer 11 is formed on the insulative substrate 10 having a single crystal structure, and the epitaxially grown single crystal structure semiconductor layer 12 is formed on the metal layer.
机译:解决的问题:在绝缘基板上形成的金属层上形成单晶半导体层,其中该半导体可以直接形成在金属层上。解决方案:在金属层上形成单晶半导体层的方法中,在形成绝缘层的表面上形成金属层并在金属层11上形成单晶结构半导体层的情况下,形成金属层时,在具有单晶结构的绝缘基板10上形成外延生长的金属层11,并且在金属层上形成外延生长的单晶结构的半导体层12。

著录项

  • 公开/公告号JPH11274561A

    专利类型

  • 公开/公告日1999-10-08

    原文格式PDF

  • 申请/专利权人 UNIV SHIZUOKA;

    申请/专利号JP19980077140

  • 申请日1998-03-25

  • 分类号H01L33/00;H01L21/20;H01L21/203;H01L21/205;H01L29/43;

  • 国家 JP

  • 入库时间 2022-08-22 02:33:49

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