ABRASIVE CLOTH CONDITIONER FOR CHEMICAL-MECHANICAL POLISHING DEVICE AND CONDITIONING METHOD THEREFOR AS WELL AS IMPROVED CHEMICAL-MECHANICAL POLISHING DEVICE FOR POLISHING SEMICONDUCTOR WAFER

摘要

PROBLEM TO BE SOLVED: To eliminate those of grains and splits from an abrasive cloth surface by having a vacuum source actively connected to an opening installed in a conditioning member. SOLUTION: A central passage 64 is extending in passing through a robot arm 68, and it is opened to a void formed by the underside of a body part 76, a conditioning member 80 and the surface of abrasive cloth 70. Two outer passages 62 and 66 communicate with both passages 72 and 74 installed in the body part 76 and an opening 78 installed in the coditioning member 80, respectively. A vacuum source is actively connected to the surface of the polishing cloth 70. Therefore, those of grains and splits produced by a conditioning process are eliminabled in the arrow direction from the abrasive cloth 70. In addition, a conditioning surface 82 makes up a seal on the surface of the abrasive cloth 70 so as to maintain a vacuum force and to make these splits and grains effectively eliminable in the case where this conditioning surface 82 of the conditioning member 80 conditions the surface of the abrasive cloth 70.