Solder ball electrode forming method and solder microspheres positioning jig to be used in the solder ball electrode forming method

摘要

PURPOSE: To easily but completely attach a microscopic solder balls to the main body of a semiconductor element. ;CONSTITUTION: A semiconductor element main body 16 is inserted into a recessed part 15a, a large quantity of solder fine balls 17 are dropped on the rear surface 15c in the state wherein the rear surface 15c of a solder fine ball positioning jig 15 is faced upward, the solder fine balls are dropped into a hole 15b, and the solder fine balls are connected to the semiconductor element body 16 by heating. As a result, the solder fine balls 17 can be arranged easily but completely on the pad 18 formed on the rear surface of the semiconductor element main body 16 without using complicated equipment.;COPYRIGHT: (C)1995,JPO