REINFORCEMENT TYPE SOLDER BALL ARRANGEMENT STRUCTURE DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a reinforcement type solder ball arrangement structure device. ;SOLUTION: The stress supporting of a printed wiring board 202 is intensified by providing a high melting point solder balls 205 on the circumferential edge of an IC package and the lower part of a die 203 where stress receiving force is relatively weak in the arrangement system of a BGA(ball grid array) structure device, and after the solder balls of the different melting points are integrated, low melting point solder balls are brought into the state of a sandglass 210, and the thermal fatigue life of the solder balls is improved.;COPYRIGHT: (C)1998,JPO