EPOXY RESIN COMPOSITION AND ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To obtain an epoxy resin composition excellent in moldability as well as in blocking resistance and storage stability and desirably for sealing electronic components such as especially surface mounting type semiconductor elements by using a combination of a specified thiobisphenol epoxy resin with a specified novolac epoxy resin as the epoxy resin component. ;SOLUTION: There is provided with an epoxy resin composition essentially consisting of an epoxy resin, a curing agent and an inorganic filler, wherein the epoxy resin component comprises 10-90 wt.% thiobisphenol epoxy resin represented by formula I (wherein R₁, R₂ and R₃ are each hydrogen or a 1-8C hydrocarbon group; G is glycidyl; and n is a number of 0-15) and 10-90 wt.% novolac epoxy resin represented by formula II (wherein R₄ is hydrogen, a halogen or a 1-8C hydrocarbon group; G is glycidyl; and m is a number of 0-15). It is also possible to combinedly use a usual epoxy resin having at least two epoxy groups in the molecule in addition to the epoxy resins represented by formulas I and II.;COPYRIGHT: (C)1999,JPO