CHIP COMPONENT MOUNTING DEVICE AND POSITIONING METHOD FOR CHIP COMPONENT AND CIRCUIT BOARD BY CHIP COMPONENT MOUNTING DEVICE

摘要

PROBLEM TO BE SOLVED: To accurately join a bump to a joining part by calculating a deviation correction amount for positioning a chip component and a circuit board after considering the allowance at the time of manufacture of the chip component and the circuit board. ;SOLUTION: This chip component mounting device 1 is provided with a board table part 3, a chip supply part 4, an optical part 5, a monitor part 6, a head part 7, a tray holding part 8 and a control part in a case body 2. The control part achieves a role as a deviation amount calculation means and a correction amount calculation means, the position deviation amount (first deviation amount) from the position on design of the bump to a pad is calculated by the deviation amount calculation means and the position deviation amount (second deviation amount) from the position on the design of the joining part to an alignment mark is calculated by the deviation amount calculation means. Then, the deviation correction amount for positioning the chip component and the circuit board is calculated by the correction amount calculation means based on the first deviation amount and the second deviation amount and the respective bumps and the respective joining parts are positioned.;COPYRIGHT: (C)1998,JPO