Device for inerciacao a bath of welding of a wave soldering machine

• 1. 一种用于波峰焊机的冰刀线装置以及焊接设备 [P] . 中国专利： CN210469925U . 2020.05.05
• 2. 一种用于波峰焊机的冰刀线装置以及焊接设备 [P] . 中国专利： CN110062536A . 2019-07-26
• 3. Device for inerciacao a bath of welding of a wave soldering machine [P] . PT99866A . 1994-01-31

  机译： 用于波峰焊机的熔池的装置

• 4. PROCESS AND PLANT FOR TREATING ALLOY OF ALL OR PART OF THE "DEAD" AREA OF THE WELDING BATH OF A SOLDERING OR WAVE-LINING MACHINE, TO ELIMINATE ALL OR PART OF THE OXIDE SCORES FORMED IN THE BATH OF [P] . 法国专利： FR2946271A1 . 2010-12-10

  机译： 处理全部或部分焊锡或波轮划线机的焊接浴“死区”合金的工艺和设备，以消除全部或部分在焊槽中形成的氧化斑

• 5. Inerting device of the solder bath of a welding machine is the wave. [P] . 法国专利： FR2670986B1 . 1996-08-02

  机译： 焊接机的锡槽的惰化装置是波。

• 1. Microwave Induced Ethanol Bath Bonding for PMMA Microfluidic Device [J] . Cuicui Zhuang 哈尔滨工业大学学报（英文版） . 2016,第002期
• 2. COMBINED PRINTED SOLDER PASTE AND PRINTED ADHESIVE PROCESSFOR DEVICES GOING THROUGH WAVE SOLDER [C] . Michael Kochanowski The industry's best technical conference on electronic assembly and advanced packaging . 2005
• 3. Laser Machining and Near Field Microwave Microscopy of Silver Inks for 3D Printable RF Devices [D] . Ross, Anthony J., III 2017
• 4. Effects of Solder Temperature on Pin Through-Hole during Wave Soldering: Thermal-Fluid Structure Interaction Analysis [O] . M. S. Abdul Aziz, M. Z. Abdullah, C. Y. Khor -1
• 5. Influence of Laser Wavelength on Melt Bath Dynamics and Resulting Seam Quality at Welding of Thick Plates [O] . Haug P., Rominger V., Speker N., 2013

• 1. Reliability Evaluation of QFN Devices Soldered Joints with Creep Model [J] . JI Feng ,XUE Songbai ,ZHANG Liang . 中国机械工程学报 . 2011,第003期
• 2. Reliability Evaluation of QFN Devices Soldered Joints with Creep Model [J] . JI Feng ,XUE Songbai ,ZHANG Liang . 中国机械工程学报 . 2011,第003期
• 3. Effect of Thermal Cycling on Properties and Microstructure of SnAgCuCe Soldered Joints in QFP Devices [J] . ZHANG Liang ,XUE Songbai ,GAO Lili . 中国机械工程学报 . 2011,第004期
• 4. Effect of Thermal Cycling on Properties and Microstructure of SnAgCuCe Soldered Joints in QFP Devices [J] . ZHANG Liang ,XUE Songbai ,GAO Lili . 中国机械工程学报 . 2011,第004期
• 5. 机械泵与感应电磁泵波峰焊机的比较与分析 [C] . 曾捷 ,张国琦 ,麻树波 . 2007中国高端SMT学术会议 . 2007
• 6. 波峰焊机控制系统 [A] . 赵建民 . 2006