A system for measuring surface characteristics of an electronic interconnection component, such as a printed circuit board, by analyzing shadow moir+E,acu e+EE patterns. Printed circuit boards are carried on a continuous conveyor under a grating. For each printed circuit board, a shadow moir+E,acu e+EE fringe pattern is created in response to a determination that the printed circuit board is properly located under a grating and within the field of view of a camera. Fringes of the shadow moir+E,acu e+EE fringe pattern are quantified over one or a multiple of analysis paths to determining if the printed circuit board is unacceptably warped, in which case a signal is generated. For each printed circuit board, multiple images can be captured and mathematically combined, by image subtraction, to produce an enhanced shadow moir+E,acu e+EE fringe pattern that is analyzed for warpage.
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机译：一种通过分析阴影波纹+ E，acu e + EE图案来测量电子互连组件（例如印刷电路板）的表面特性的系统。印刷电路板在格栅下的连续输送机上运输。对于每个印刷电路板，响应于确定印刷电路板适当地位于光栅下方并且在照相机的视场内而创建阴影纹+ E，acu e + EE条纹图案。在一条或多条分析路径上量化阴影波纹+ E，acu e + EE条纹的条纹，以确定印刷电路板是否翘曲，在这种情况下会产生信号。对于每个印刷电路板，可以通过图像相减来捕获多个图像并进行数学组合，以生成增强的阴影波纹+ E，acu e + EE条纹图案，并对其进行翘曲分析。
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