首页> 外国专利> Structure resin for photovoltaic composition for deep ultraviolet exposure for the manufacture of semiconductor devices, method for producing the same, and photoresist composition for deep ultraviolet ray exposure

Structure resin for photovoltaic composition for deep ultraviolet exposure for the manufacture of semiconductor devices, method for producing the same, and photoresist composition for deep ultraviolet ray exposure

机译:用于半导体器件制造的用于深紫外线曝光的光伏组合物的结构树脂,其制造方法和用于深紫外线曝光的光致抗蚀剂组合物

摘要

The present invention relates to a structural resin for photovoltaic composition for deep ultraviolet exposure for the production of a semiconductor device, a method for producing the same, and a photoresist composition for deep ultraviolet exposure comprising the structural resin.;The present invention provides a norbornene resin as a structural resin for a photoresist composition for deep ultraviolet exposure which can be exposed using deep ultraviolet rays as a light source in a photolithography process in the process for manufacturing a semiconductor device, And a photoresist composition for deep ultraviolet exposure comprising the norbornene resin.;Accordingly, there is an effect of providing a deep ultraviolet ray photoresist composition which has sufficient transparency even in the far ultraviolet ray of about 193 nm, is excellent in corrosion-resisting property, has a clear pattern contrast upon development, and exhibits high resolution.
机译:本发明涉及用于制造半导体器件的用于深紫外曝光的光伏组合物的结构树脂,其制造方法以及包含该结构树脂的用于深紫外曝光的光致抗蚀剂组合物。作为用于深紫外线曝光的光致抗蚀剂组合物的结构树脂的树脂,其可以在制造半导体器件的过程中在光刻工艺中使用深紫外线作为光源曝光;以及包含降冰片烯树脂的用于深紫外线曝光的光致抗蚀剂组合物因此,提供了一种深紫外线光刻胶组合物的效果,该组合物即使在约193nm的远紫外线下也具有足够的透明度,具有优异的耐腐蚀性能,在显影时具有清晰的图案对比度,并且显示出高的耐光性。解析度。

著录项

  • 公开/公告号KR19980082690A

    专利类型

  • 公开/公告日1998-12-05

    原文格式PDF

  • 申请/专利权人 윤종용;

    申请/专利号KR19970017741

  • 发明设计人 이성호;송호종;

    申请日1997-05-08

  • 分类号H01L21/027;

  • 国家 KR

  • 入库时间 2022-08-22 02:18:57

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