Structure resin for photovoltaic composition for deep ultraviolet exposure for the manufacture of semiconductor devices, method for producing the same, and photoresist composition for deep ultraviolet ray exposure

摘要

The present invention relates to a structural resin for photovoltaic composition for deep ultraviolet exposure for the production of a semiconductor device, a method for producing the same, and a photoresist composition for deep ultraviolet exposure comprising the structural resin.;The present invention provides a titanium polymer resin as a structural resin for a photoresist composition for deep ultraviolet exposure which can be exposed by using ultraviolet light as a light source in a photolithography process in the process for manufacturing a semiconductor device, The resin having the main chain obtained by polymerizing thi-butoxycarbonyloxystyrene (TIBIS) with an Inifer is a resin for producing a bispecific polymerization resin and a deep ultraviolet photopolymer Thereby providing a resist composition.;Accordingly, there is an effect of providing a deep ultraviolet ray photoresist composition which has sufficient transparency even in the far ultraviolet ray of about 193 nm, is excellent in corrosion-resisting property, has a clear pattern contrast upon development, and exhibits high resolution.