Silicon wafer fabrication method and mounting structure of silicon wafer and photodiode chip

摘要

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a silicon wafer manufacturing method for mounting a photodiode on a silicon wafer in an optical communication transmission module, and a mounting structure of a silicon wafer and a photodiode chip, comprising a silicon wafer (100), and the silicon wafer (100). On the upper surface of the laser diode chip 12 and the photodiode chip 10, each laser diode chip groove 120 and the photodiode chip groove 130 to be mounted are formed in a line to match the optical axis, In the photodiode chip groove 130, a plurality of silicon blocks 132 are formed so that the mounting cross section of the photodiode chip 10 to be mounted thereto may be installed at a predetermined inclination with respect to the optical axis. The groove 120 and the photodiode chip fin groove 130 are characterized in that each laser diode chip 12 and the photodiode chip 10 is mounted.