How to set margin rate of test specification of semiconductor manufacturing process

摘要

Randomly selecting n repeat test samples, and performing 50 or more repeat tests to generate respective test data, and calculating E (r), σ (r), and Cp (r) from the test data. Determining whether Cp (r) is greater than 5, debugging the corresponding item if Cp (r) is not greater than 5, and MEDS (r), MFT if Cp (r) is greater than 5. (r) is calculated, MEDS (r) and MFT (r) are added to find M (r) ', and after 100 or more run test samples are selected, it is determined whether or not it is three or more runs. If not, add a run sample for a run test, extract run test data when three or more runs, and calculate σ (run), Cp (run), and Cpk (run), and Cpk (run) If the Cpk (run) is not greater than 1, the process capacity is checked to determine whether it is greater than 1, and if the Cpk (run) is greater than 1, M (run) is calculated. The system judges whether 2M (r) 'is smaller than M (run). When 2M (r)' is not smaller than M (run), M (r) 'is set to M (t), and 2M (r)' is smaller than M (run). when r) 'is smaller than M (run), setting M (r)' + (M (run) -2M (r) ') x0.1 to M (t), and M (t) for each item. It is included in the process of setting up a new test specification by applying), and the semiconductor manufacturing process has the effect of increasing the accuracy and reliability of the test specification by setting the margin ratio of the test specification by using the repeatability and process distribution data analysis. Provides a way to set the margin percentage of a test specification.