BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder ball bumping apparatus, in which a plurality of solder ball receiving holes are formed on the back surface of a BGA (Ball Grid Array) package, In the prior art, since the work is performed manually, the time required for the operation is long, so that the productivity is reduced, and the solder ball can not be accurately seated in the solder ball mounting hole, resulting in a large number of defects. In order to place hundreds of solder balls on the solder ball seating holes, the PCB frame material is accurately loaded, and the loaded PCB frame material is adsorbed and fixed to the index unit controlled by the linear motor, and the flux is transferred to the backside of the package Then, the solder ball is placed on the solder ball, and after inspection, the furnace ace of solder ball bumping equipment to prevent solder balls from sticking to the backside of the BGA package to prevent defects and improve productivity when the solder balls are adsorbed.
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