WAFER WHICH HAS OUTSIDE DECLINE

摘要

1. The technical field of the invention as set forth in the claims;A wafer having an outer circumferential sloped surface.;2. The technical problem the invention is trying to solve;When P / R is applied, the centrifugal force at the wafer edge can overcome the surface tension in place and proceed smoothly to the outside, resulting in thinner and better P / R coating and flatness. To provide an improved wafer to improve the efficiency of the process.;3. Summary of solution of design;A wafer applied to a photoresist coating process during a lithography process, wherein the wafer has an inclined surface formed at a peripheral edge thereof, and the inclined surface is formed such that the inclined surface is gradually lowered from the original surface height toward the outside from the inside of the edge portion. To provide a wafer.;4. Important uses of the devise;In the semiconductor device manufacturing process, it is applied to the lithography process, it is possible to ensure the uniformity of the thin P / R coating film and coating film thickness, and to prevent damage to the wafer coating film in the EBR process, there is an effect of improving the yield.