A method for selectively galvanic application of solder deposits on printed circuit boards

摘要

Electrodeposition of planar solder deposits (8) on circuit boards, having selectively masked metallic conductor lines and metal pads (1) on an insulating substrate, involves: (a) applying an overall additional conductive layer (6) and a structured mask (7); (b) selectively removing the structured mask (7) and the additional conductive layer (6) from the metal pads (1) to be provided with solder deposits (8), the conductive layer (6) remaining in contact with the edges of these metal pads (1); (c) electrodepositing one or more layers into the resulting openings; and (d) removing the structured mask (7) and the conductive layer (6) from the circuit board to leave solder deposits (8) on the metal pads. Step (a) may consist of applying a mixture of a photo-structurable polymer and a conductive material and the conductive layer (6) may be a metal layer, a conductive polymer layer or a conductive material-filled polymer layer.