首页> 外国专利> METHOD FOR PREPARING PRINTED CIRCUIT BOARDS, METHOD FOR SELECTIVELY DEPOSITING WELDING ON PARTS OF A PRINTED CIRCUIT BOARD, DEVICE FOR PRODUCING PRINTED CIRCUIT BOARDS AND MULTI-VACUUM BOARD ASSEMBLY

METHOD FOR PREPARING PRINTED CIRCUIT BOARDS, METHOD FOR SELECTIVELY DEPOSITING WELDING ON PARTS OF A PRINTED CIRCUIT BOARD, DEVICE FOR PRODUCING PRINTED CIRCUIT BOARDS AND MULTI-VACUUM BOARD ASSEMBLY

机译:印刷电路板的制备方法,印刷电路板上的零件的选择性沉积方法,印刷电路板和多真空板组件的生产装置

摘要

Printed circuit boards are made by imaging a liquid polymer which has been coated onto the board. The imaging is accomplished while the polymer is wet with the photo tool in a close air gap relationship with the coated board. The uncured polymer which remains liquid is removed after imaging so that the board can be processed by etch resist, plate resist, or solder mask techniques. The cured polymer is removed by stripping with an alkaline solution. The apparatus consists of single station or multi- station equipment to carry out the unit operations of maintaining the board in a set position, coating with a liquid polymer, placing a photo tool in registration with the circuit board blank and in close relationship with the coating, and imaging the liquid polymer via the photo tool to cause areas of the coating to solidify and other areas to remain liquid.
机译:印刷电路板是通过对已涂覆在板上的液态聚合物进行成像而制成的。成像是在用照相工具将聚合物弄湿的情况下完成的,并且与涂层板之间的气隙关系密切。成像后将残留的未固化聚合物去除,从而可以通过抗腐蚀,抗镀或阻焊技术处理电路板。通过用碱性溶液汽提除去固化的聚合物。该设备由单工位或多工位设备组成,以执行以下单元操作:将板保持在固定位置,用液态聚合物涂覆,将照相工具与电路板毛坯对齐并与涂层保持紧密关系,并通过照相工具对液态聚合物进行成像,以使涂层区域固化,而其他区域则保持液态。

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