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Tracking method of faulty integrated circuits on surface mounted devices using flying probe test arrangement

机译:使用飞针测试装置跟踪表面安装器件上的故障集成电路的方法

摘要

The method uses a vector less test method. Current voltage characteristic curves from input or output circuits of the electronic components (7) and their current consumption are measured as a function of the supply voltage and are analysed. The supply voltage is provided by two galvanic contacts and the current consumption is obtained indirectly via a magnetic field sensor (5). The magnetic field sensor (5) measures the local magnetic fields caused by the current. Input and output circuits of an electronic component (7) may be galvanically contacted via a corresponding circuit node. The respective second contact may be connected to an earth terminal or a supply voltage terminal of the component (7).
机译:该方法使用无矢量测试方法。电子元件(7)的输入或输出电路的电流电压特性曲线及其电流消耗根据电源电压进行测量并进行分析。供电电压由两个电流触点提供,电流消耗通过磁场传感器(5)间接获得。磁场传感器(5)测量由电流引起的局部磁场。电子部件(7)的输入和输出电路可以通过相应的电路节点电接触。各个第二触点可以连接到部件(7)的接地端子或电源电压端子。

著录项

  • 公开/公告号DE19804171A1

    专利类型

  • 公开/公告日1999-09-16

    原文格式PDF

  • 申请/专利权人 SIEMENS AG;

    申请/专利号DE1998104171

  • 申请日1998-02-03

  • 分类号G01R31/302;G01R15/20;H05K13/08;

  • 国家 DE

  • 入库时间 2022-08-22 02:12:52

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