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Heat sink for electronic components

机译:电子零件散热器

摘要

The heatsink consists of a pressed and bend sheet metal strip of ripped shape, whose surface area is approx. equal to a surface area of an electronic component (2) which comprises a centrally positioned heat slug (3) with a small surface area. A number of bends (9) of the heatsink (1) contact the heat slug of the component in an assembled condition. The lower bends of the heatsink are connected to upper bends (8) by rips (7), and the external rips comprise projections (18) above the upper bends, which have inwards directed edges (14). The edges hold a fan (4) in a vertical position, and the fan rests on two exterior bends which comprise a snapper (13) which holds the heatsink in a horizontal position. The lower ends of the outer rips comprise edges which are directed inwards, and which are held in respective extrusions of a socket of the component, so that the lower bends are pressed against the heat slug and that the projections are attached to the fan.
机译:散热片由压制弯曲的金属薄板条组成,其表面积约为2毫米。等于电子元件(2)的表面积,该电子元件(2)包括具有小表面积的位于中心的散热块(3)。散热器(1)的许多弯头(9)在组装状态下接触组件的散热片。散热器的下部弯曲部通过裂片(7)连接至上部弯曲部(8),并且外部裂片包括在上部弯曲部上方的具有向内指向的边缘(14)的突起(18)。边缘将风扇(4)保持在垂直位置,风扇停靠在两个外部弯头上,这些弯头包括将散热片保持在水平位置的卡扣(13)。外部裂口的下端包括向内指向的边缘,这些边缘被保持在部件的承窝的相应的挤压件中,从而使下部弯曲部被压在散热块上,并且突起被附接到风扇上。

著录项

  • 公开/公告号DE29623350U1

    专利类型

  • 公开/公告日1999-04-01

    原文格式PDF

  • 申请/专利权人 SIEMENS AG 80333 MUENCHEN DE;

    申请/专利号DE1996223350U

  • 发明设计人

    申请日1996-09-30

  • 分类号H01L23/40;H01L23/34;H05K7/20;

  • 国家 DE

  • 入库时间 2022-08-22 02:12:39

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