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Method of manufacture of devices in thin layers using the technique of the anisotropic reflectance

机译:利用各向异性反射技术制造薄层器件的方法

摘要

Method of control of the processes for the manufacture of devices in thin layers, in particular of semi conducting -. The method according to the invention consists, during the etching or deposition of a thin layer on a substrate, to measure the variations of a characteristic quantity of a reflectance anisotropic under normal incidence, or virtually - normal of a sample during this step of deposition or etching in order to obtain a signature characterizing this step of etching or deposition, and to use this signature for controlling and / or adjust the step of etching or deposition of a thin layer similar during the subsequent production of other similar devices. The application or control of the methods of manufacture of semi-finished - conductors.
机译:控制用于制造薄层,特别是半导体的器件的方法的方法。根据本发明的方法包括:在基板上蚀刻或沉积薄层的过程中,在沉积或沉积的这一步骤中,在样品的法向入射或实际上-法线入射下测量反射率各向异性特征量的变化。为了获得表征该蚀刻或沉积步骤的特征的蚀刻,并使用该特征来控制和/或调节在其他类似器件的后续生产期间相似的薄层的蚀刻或沉积的步骤,蚀刻。半成品导体制造方法的应用或控制。

著录项

  • 公开/公告号FR2771850A1

    专利类型

  • 公开/公告日1999-06-04

    原文格式PDF

  • 申请/专利权人 FRANCE TELECOM;

    申请/专利号FR19970015150

  • 申请日1997-12-02

  • 分类号H01L21/66;

  • 国家 FR

  • 入库时间 2022-08-22 02:10:20

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