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Advanced modular cell placement system with fast procedure for finding a levelizing cut point

机译:先进的模块化单元放置系统,可快速找到找平的切点

摘要

A system for defining a cut point dividing a plurality of cells located on the surface of a semiconductor chip is disclosed herein. The surface has at least one region located thereon. The system comprises dividing each region into subregions, computing the capacity of each subregion, finding the maximum and minimum cell locations within each region, dividing the range spanning the maximum and minimum cell locations into a plurality of subintervals, calculating an index for each cell based on the subinterval containing the cell, accumulating cell heights for each subinterval, determining the values of cell heights for each region as the sum of cell heights for all prior regions, locating the minimum index such that the cell heights for each region are most closely proportional to the capacity of the associated subregion, and finding the cut line based on said minimum index and the maximum and minimum cell locations.
机译:本文公开了一种用于定义分割点的系统,该分割点划分位于半导体芯片的表面上的多个单元。该表面具有位于其上的至少一个区域。该系统包括将每个区域划分为子区域,计算每个子区域的容量,找到每个区域内的最大和最小小区位置,将跨越最大和最小小区位置的范围划分为多个子间隔,基于每个小区计算索引。在包含像元的子区间上,累加每个子区间的像元高度,将每个区域的像元高度值确定为所有先前区域的像元高度之和,找到最小索引,以使每个区域的像元高度与比例最接近确定相关子区域的容量,并根据所述最小索引以及最大和最小单元位置找到切割线。

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