首页> 外国专利> Method for forming advanced transistor structures with optimum short channel controls for high density/high performance integrated circuits

Method for forming advanced transistor structures with optimum short channel controls for high density/high performance integrated circuits

机译:用于高密度/高性能集成电路的具有最佳短沟道控制的先进晶体管结构的形成方法

摘要

A novel MOS transistor structure for improving device scaling by improving short channel control includes a buried back gate beneath a channel region of the MOS transistor. A separate contact to a well that is electrically communicated to the buried back gate improves short channel controls without performance degradations. In a preferred embodiment, the back gate is grounded when turning the n-channel MOS transistor off. In alternate embodiments, the buried layer produces retrograde p wells. In some applications, multiple buried layers may be used, with one or more being planar. CMOS devices may have independent, multiple buried back gates.
机译:用于通过改善短沟道控制来改善器件定标的新颖的MOS晶体管结构包括在MOS晶体管的沟道区下方的掩埋背栅。电连接至埋入式背栅的阱的单独接触可改善短通道控制,而不会降低性能。在优选实施例中,当关断n沟道MOS晶体管时,背栅接地。在替代实施例中,掩埋层产生逆行p阱。在一些应用中,可以使用多个掩埋层,其中一个或多个是平坦的。 CMOS器件可能具有独立的多个掩埋后栅极。

著录项

  • 公开/公告号US5877049A

    专利类型

  • 公开/公告日1999-03-02

    原文格式PDF

  • 申请/专利权人 ADVANCED MICRO DEVICES INC.;

    申请/专利号US19960717981

  • 发明设计人 YOWJUANG W. LIU;KUANG-YEH CHANG;

    申请日1996-09-23

  • 分类号H01L21/8238;

  • 国家 US

  • 入库时间 2022-08-22 02:08:39

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